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Copper Composite Metal

Copper Composite Metal-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Clad Metal--Copper & Aluminum

Clad Metal--Copper &amp; Aluminum-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Copper Clad Metal Strip

Copper Clad Metal Strip-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Copper Clad Metal Plate

Copper Clad Metal Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

CW110C Copper Beryllium C17510 Plate

CW110C Copper Beryllium C17510 Plate-C17500
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Features: CW110C Copper Beryllium C17510 Plate, It have high conductivity and high hardness
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: C17500, Application: Plastic Moulding industry, Weight: optional, Dimensions: optional, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): abt. 97%, Thickness: from 8mm to 100mm, Width: from 20mm to 500mm, Elongation (? %): depends on the temper, product: CW110C Copper Beryllium C17510 Plate

Copper Aluminum Bimetal Plate

Copper Aluminum Bimetal Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Clad Metal Plate Copper/Aluminum

Clad Metal Plate Copper/Aluminum-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Copper-Aluminum Bimetallic Plate

Copper-Aluminum Bimetallic Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Bended Copper and Aluminum Bimetal

Bended Copper and Aluminum Bimetal-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Copper T2/Aluminum Clad Metal Plate

Copper T2/Aluminum Clad Metal Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Copper/Aluminum Conductive Material

Copper/Aluminum Conductive Material-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

CW105C Chromium Copper C18200 Round Wire

CW105C Chromium Copper C18200 Round Wire-C18200
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Features: CW105C Chromium Copper C18200 Round Wire, 1,It have high conductivity, 2,resistance welding alloys
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: C18200, Application: oil&gas&mining /plastic mould tooling/RWMA, Weight: Customized, Dimensions: Customized, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): Customized, Product: CW105C Chromium Copper C18200 Round Wire

Aluminum 1060/Copper Clad Metal Plate

Aluminum 1060/Copper Clad Metal Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Round Wire CuCoNiBe Beryllium Copper Alloys

Round Wire CuCoNiBe Beryllium Copper Alloys-CuCoNiBe
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Features: Round Wire CuCoNiBe Beryllium Copper Alloys, It have high conductivity and high quality
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: CuCoNiBe, Application: Oils & Gas & Moulding Industry, Weight: optional, Dimensions: optional, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): abt. 97%, Thickness: from 8mm to 100mm, Width: from 20mm to 500mm, Elongation (≥ %): depends on the temper, product: Round Wire CuCoNiBe Beryllium Copper Alloys

90 degree Bended Copper and Aluminum Bimetal

90 degree Bended Copper and Aluminum Bimetal-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Bended Copper and Aluminum Composite Material

Bended Copper and Aluminum Composite Material-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Excellent Conductivity Copper/Aluminum Bimetal

Excellent Conductivity Copper/Aluminum Bimetal-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

0.2-15mm thickness Copper-Aluminum Bimetallic Plate

0.2-15mm thickness Copper-Aluminum Bimetallic Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Various Thickness Copper and Aluminum Composite Plate

Various Thickness Copper and Aluminum Composite Plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

Solid-Liquid machining processing technique Copper T2 + Aluminum 1060 metal plate

Solid-Liquid machining processing technique Copper T2 + Aluminum 1060 metal plate-tape
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Features: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12

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