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Copper Composite Metal
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Clad Metal--Copper & Aluminum
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Copper Clad Metal Strip
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Copper Clad Metal Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
CW110C Copper Beryllium C17510 Plate
See DetailsFeatures: CW110C Copper Beryllium C17510 Plate, It have high conductivity and high hardness
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: C17500, Application: Plastic Moulding industry, Weight: optional, Dimensions: optional, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): abt. 97%, Thickness: from 8mm to 100mm, Width: from 20mm to 500mm, Elongation (? %): depends on the temper, product: CW110C Copper Beryllium C17510 Plate
Copper Aluminum Bimetal Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Clad Metal Plate Copper/Aluminum
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Copper-Aluminum Bimetallic Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Bended Copper and Aluminum Bimetal
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Copper T2/Aluminum Clad Metal Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Copper/Aluminum Conductive Material
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
CW105C Chromium Copper C18200 Round Wire
See DetailsFeatures: CW105C Chromium Copper C18200 Round Wire, 1,It have high conductivity, 2,resistance welding alloys
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: C18200, Application: oil&gas&mining /plastic mould tooling/RWMA, Weight: Customized, Dimensions: Customized, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): Customized, Product: CW105C Chromium Copper C18200 Round Wire
Aluminum 1060/Copper Clad Metal Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Round Wire CuCoNiBe Beryllium Copper Alloys
See DetailsFeatures: Round Wire CuCoNiBe Beryllium Copper Alloys, It have high conductivity and high quality
Quick Brief: Place of Origin: Fujian China (Mainland), Brand Name: ALB-ALLOY, Model Number: CuCoNiBe, Application: Oils & Gas & Moulding Industry, Weight: optional, Dimensions: optional, Grade: beryllium copper, Alloy Or Not: Is Alloy, Powder Or Not: Not Powder, Cu Content (%): abt. 97%, Thickness: from 8mm to 100mm, Width: from 20mm to 500mm, Elongation (≥ %): depends on the temper, product: Round Wire CuCoNiBe Beryllium Copper Alloys
90 degree Bended Copper and Aluminum Bimetal
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Bended Copper and Aluminum Composite Material
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Excellent Conductivity Copper/Aluminum Bimetal
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
0.2-15mm thickness Copper-Aluminum Bimetallic Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Various Thickness Copper and Aluminum Composite Plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
Solid-Liquid machining processing technique Copper T2 + Aluminum 1060 metal plate
See DetailsFeatures: 1, Meet all thickness between 0.20mm to 15mm in ratio of 20Cu:80Al, 2, No limit to length and area, 3, Lighter & lower cost
Quick Brief: Place of Origin: China (Mainland), Brand Name: Hejin, Model Number: tape, Application: Decoration, Electrical Conduction, Weight: As request, Dimensions: Thickness: 0.2-15mm, Grade: Copper T2, Aluminum series 1, 3, 8, Alloy Or Not: Non-alloy, Powder Or Not: Not Powder, Cu Content (%): 15-20, Technique: Solid-Liquid machining processing, Material: Copper T2, Aluminum 1060, Specification(thickness * width): 0.1mm-15mm*30mm-1000mm, Copper and Aluminum weight ratio: Cu:AL: 32%-40%: 60%-68%, Copper and Aluminum volume ratio: Cu:AL: 15-20: 80-85, Density(g/cm3): 3.5-3.9, Resistivity(Ωmm2/m): <0.019, Tensile Strength(N/mm2): More than 120, Elongation(%): 27-38, Peeling Strength(N/mm): more than 12
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