Ultrafine Copper Powder 2um - BNY-Cu01

Ultrafine Copper Powder, Ultrafine CuAg Alloy Powder, Ultrafine CuNi Alloy Powder - details see: http://www.sourcingmetals.com/ultrafine-copper-powder-2um-10147358
Purity: 99.9%Dimensions: Cu-03Place of Origin: Zhejiang China (Mainland)Brand Name: BNY
Model Number: BNY-Cu01   
Ultrafine Copper Powder 2um
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Ultrafine Copper Powder

Applications:Efficient catalysts:The large and highly active surface area, ultrafine copper has a greatly enhancement catalytic efficiency. Instead of conventional micro copper, ultrafine copper powder can be used for methanol industry.

Conductive paste:Electronic paste is widely used in micro-electronics industry packaging, connectivity, miniaturization of microelectronic devices. ultrafine copper electronic paste has superior performance as micro copper. It is widely used in MLCC.

Sintering additives:ultrafine copper powder has large volume ratio of surface atoms, which have so high energy state. In the powder metallurgical industry, it can be used as sintering additive to reduce sintering temperature in production of ceramic and diamond tools .

Medicine and anti bacteria:ultrafine copper powder can be used widely in medical industry and to anti bacteria.

Lubricant addictive:ultrafine copper powder can be dispersed into lubricant to decrease the surface friction and repair micro defects of the friction surface.

Specification

particle size

(μm)

specific surface area

(m2/g)

Laser Particle SizePSA(μm)

Tap density

(g/cm3)

D10D50D90
Cu-010.301.69-2.69≤0.50≤1.00≤1.80≥2.60
Cu-020.501.10-1.70≤1.20≤1.50≤3.50≥3.00
Cu-031.000.50-1.00≤1.50≤2.50≤5.50≥3.50

UltrafineCuAg Alloy Powder

Application:Be extensively applied to conductive adhesive, conductive coating, polymer paste, micro electronic technique field with demand for electric conduction and static electric conduction, electromagnetic shielding, and non-conductive material surface metallization treatment

Specification

Particle Size(μm)

Specific Surface Area

(m2/g)

Size Distribution (μm)

Silver Content

(wt%)

D10

D50

D90

CuAg-01

0.50

1.05-1.70

0.80-1.80

1.05-1.45

2.80-3.30

30

CuAg-02

1.00

0.90-1.10

2.10-2.60

3.10-3.60

5.20-5.80

30

CuAg-03

5.0

0.25-0.30

3.30-3.80

5.40-6.30

8.80-10.30

15

CuAg-04

1.90-2.00

1.50-1.70

3.00-3.50

5.00-5.60

30

CuAg-05

0.80-0.95

2.50-3.20

3.80-4.11

5.80-6.30

30

CuAg-06

0.35-0.60

3.20-3.80

5.40-6.30

8.80-10.30

20

UltrafineCuNi Alloy Powder

Applications:Be applied to thetermination and internal electrode of multi-Layered Ceramic Capacitors ,as well as the slurry of other electronic components.

SpecificationMean particle size

(μm)

Specific Surface area

(m2/g)

Tap Desity

(g/cm3)

Ni content(%)
CuNi-010.501.04-1.69≥3.0010,20,30
CuNi-021.000.56-0.90≥3.50,10,20,30
Packaging Detail:Vaccum Bag
Delivery Detail:10day after payment

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